Tray part#, maximum temperature & pocket count & matrix can be referred to in the below box.
step1. IC Package Name
MQFP
LQFP
TQFP
TSOP
BGA- CSP etc.
CHIP TRAYS
Explanation of IC package
| Name | Stored in | Explanation |
|---|---|---|
| MQFP | MQFP | Metric Quad Flat Package（Lead Package Type） |
| LQFP | LQFP | Low-profile Quad Flat Package (1.4mm)（Lead Package Type） |
| TQFP | TQFP | Thin Quad Flat Package (1.0mm)（Lead Package Type） |
| TSOP | TSOP | Thin Small Outline Package（Lead Package Type） Two kinds (Type-I and Type-II) exist. |
| BGA | BGA | Ball Grid Array（Array Package Type） |
| FBGA | BGA | Fine-pitch Ball Grid Array（Array Package Type） |
| RBGA | BGA | Rectangular Ball Grid Array（Array Package Type） |
| FRBGA | BGA | Fine-pitch Rectangular Ball Grid Array（Array Package Type） |
| CSP | CSP etc. | Chip Scale Package |
| LCC | CSP etc. | Lead-less Chip Carrier |
| QFN | CSP etc. | Quad Flat No-lead |
| LGA | CSP etc. | Land Grid Array |
| BCC | CSP etc. | Bump Chip Carrier |
| MLF | CSP etc. | Micro Lead Frame |
