Tray part#, maximum temperature & pocket count & matrix can be referred to in the below box.

Explanation of IC package

Name Stored in Explanation
MQFP MQFP Metric Quad Flat Package(Lead Package Type)
LQFP LQFP Low-profile Quad Flat Package (1.4mm)(Lead Package Type)
TQFP TQFP Thin Quad Flat Package (1.0mm)(Lead Package Type)
TSOP TSOP Thin Small Outline Package(Lead Package Type)
Two kinds (Type-I and Type-II) exist.
BGA BGA Ball Grid Array(Array Package Type)
FBGA BGA Fine-pitch Ball Grid Array(Array Package Type)
RBGA BGA Rectangular Ball Grid Array(Array Package Type)
FRBGA BGA Fine-pitch Rectangular Ball Grid Array(Array Package Type)
CSP CSP etc. Chip Scale Package
LCC CSP etc. Lead-less Chip Carrier
QFN CSP etc. Quad Flat No-lead
LGA CSP etc. Land Grid Array
BCC CSP etc. Bump Chip Carrier
MLF CSP etc. Micro Lead Frame
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