When pick and place machines release IC packages slight rotations of IC packages are seen.
This patent works to minimize the rotations and helps to put the rotated IC packages back into the correct places.
Conventional designs
Pattern 1
Cross shaped guides are located.
Rotated packages get landed onto the corners.
Pattern 2
Cross shaped guides are located.
Rotated packages get landed onto the corners.
The patented design
Same cross shaped guides,however, bigger angles are allocated over the lines of the guides.
The IC packages are corrected back into the pocket without getting landed onto corners.
